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Conference Paper

Effect of Process Parameters on the Microstructure and Properties of TiC Dispersion Strengthened Copper Alloys

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Dehm,  Gerhard
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Mayer,  Joachim
Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Weißgärber, T., Sauer, C., Püsche, W., Kieback, B. F., Dehm, G., & Mayer, J. (1997). Effect of Process Parameters on the Microstructure and Properties of TiC Dispersion Strengthened Copper Alloys. In Advances in Powder Metallurgy and Particulate Materials - 1997 (pp. 1123-1134). Princeton NJ: Metal Powder Industries Federation; APMI International.


Cite as: https://hdl.handle.net/21.11116/0000-0001-9A27-6
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