An elevated temperature study of a Ti adhesion layer on polyimide

Taylor, A. A.; Cordill, M. J.; Bowles, L.; Schalko, J.; Dehm, G.

doi:10.1016/j.tsf.2013.01.016

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An elevated temperature study of a Ti adhesion layer on polyimide

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Dehm, G.
Structure and Micro-/Nanomechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Taylor, A. A., Cordill, M. J., Bowles, L., Schalko, J., & Dehm, G. (2013). An elevated temperature study of a Ti adhesion layer on polyimide. Thin Solid Films, 531, 354-361. doi:10.1016/j.tsf.2013.01.016.

Cite as: https://hdl.handle.net/11858/00-001M-0000-0019-2474-F

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