de.mpg.escidoc.pubman.appbase.FacesBean
Deutsch
 
Hilfe Wegweiser Datenschutzhinweis Impressum Kontakt
  DetailsucheBrowse

Datensatz

DATENSATZ AKTIONENEXPORT

Freigegeben

Zeitschriftenartikel

Spinodal Superlattices of Topological Insulators

MPG-Autoren
http://pubman.mpdl.mpg.de/cone/persons/resource/persons213699

Curtarolo,  Stefano
Center for Materials Genomics, Duke University;
Theory, Fritz Haber Institute, Max Planck Society;
Materials Science, Electrical Engineering, Physics and Chemistry, Duke University;

Externe Ressourcen
Es sind keine Externen Ressourcen verfügbar
Volltexte (frei zugänglich)
Es sind keine frei zugänglichen Volltexte verfügbar
Ergänzendes Material (frei zugänglich)
Es sind keine frei zugänglichen Ergänzenden Materialien verfügbar
Zitation

Usanmaz, D., Nath, P., Toher, C., Plata, J. J., Friedrich, R., Fornari, M., et al. (2018). Spinodal Superlattices of Topological Insulators. Chemistry of Materials, 30(7), 2331-2340. doi:10.1021/acs.chemmater.7b05299.


Zitierlink: http://hdl.handle.net/21.11116/0000-0001-508C-7
Zusammenfassung
Spinodal decomposition is proposed for stabilizing self-assembled interfaces between topological insulators (TIs) by combining layers of iso-structural and iso-valent TlBiX2 (X = S, Se, Te) materials. The composition range for gapless states is addressed concurrently to the study of thermodynamically driven boundaries. By tailoring composition, the TlBiS2–TlBiTe2 system might produce both spinodal superlattices and two-dimensional eutectic microstructures, either concurrently or separately. The dimensions and topological nature of the metallic channels are determined by following the spatial distribution of the charge density and the spin-texture. The results validate the proof of concept for obtaining spontaneously forming two-dimensional TI-conducting channels embedded into three-dimensional insulating environments without any vacuum interfaces. Since spinodal decomposition is a controllable kinetic phenomenon, its leverage could become the long-sought enabler for effective TI technological deployment.