Evolution of microstructure and stress of and associated whisker growth on Sn 
layers sputter-deposited on Cu substrates

Sobiech, M.; Krüger, C.; Welzel, U.; Wang, J. Y.; Mittemeijer, E. J.; Hügel, W.

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Evolution of microstructure and stress of and associated whisker growth on Sn layers sputter-deposited on Cu substrates

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Sobiech, M.
Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Krüger, C.
Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Welzel, U.
Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Wang, J. Y.
Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Mittemeijer, E. J.
Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society;
Universität Stuttgart, Institut für Materialwissenschaft;

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Sobiech, M., Krüger, C., Welzel, U., Wang, J. Y., Mittemeijer, E. J., & Hügel, W. (2010). Evolution of microstructure and stress of and associated whisker growth on Sn layers sputter-deposited on Cu substrates. Journal of Materials Research, 25, 2166-2174.

Cite as: https://hdl.handle.net/11858/00-001M-0000-0010-4FA9-4

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