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Stress relaxation mechanisms of Sn and SnPb coatings electrodeposited on Cu: avoidance of whiskering

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http://pubman.mpdl.mpg.de/cone/persons/resource/persons76125

Sobiech,  M.
Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society;

http://pubman.mpdl.mpg.de/cone/persons/resource/persons76192

Teufel,  J.
Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society;

http://pubman.mpdl.mpg.de/cone/persons/resource/persons76284

Welzel,  U.
Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society;

http://pubman.mpdl.mpg.de/cone/persons/resource/persons75858

Mittemeijer,  E. J.
Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society;
Universität Stuttgart, Institut für Materialwissenschaft;

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Citation

Sobiech, M., Teufel, J., Welzel, U., Mittemeijer, E. J., & Hügel, W. (2011). Stress relaxation mechanisms of Sn and SnPb coatings electrodeposited on Cu: avoidance of whiskering. Journal of Electronic Materials, 40(11), 2300-2313. doi:10.1007/s11664-011-1737-3.


Cite as: http://hdl.handle.net/11858/00-001M-0000-0010-4E20-F
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