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Conference Paper

Passivation effects in copper thin films

MPS-Authors
http://pubman.mpdl.mpg.de/cone/persons/resource/persons76289

Wiederhirn,  G.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

http://pubman.mpdl.mpg.de/cone/persons/resource/persons75245

Balk,  T. J.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

http://pubman.mpdl.mpg.de/cone/persons/resource/persons75388

Dehm,  G.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

http://pubman.mpdl.mpg.de/cone/persons/resource/persons75903

Nucci,  J.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

http://pubman.mpdl.mpg.de/cone/persons/resource/persons75996

Richter,  G.
Central Scientific Facility Thin Film Laboratory, Max Planck Institute for Intelligent Systems, Max Planck Society;

http://pubman.mpdl.mpg.de/cone/persons/resource/persons75228

Arzt,  E.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;
Universität Stuttgart, Institut für Metallkunde;

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Citation

Wiederhirn, G., Balk, T. J., Dehm, G., Nucci, J., Richter, G., & Arzt, E. (2006). Passivation effects in copper thin films. In E. Zschech, K. Maex, P. S. Ho, H. Kawasaki, & a. T. Nakamura (Eds.), Stress-Induced Phenomena in Metallization (pp. 185-191). Melville, N.Y.: AIP.


Cite as: http://hdl.handle.net/11858/00-001M-0000-0010-46F3-F
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