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Journal Article

Frequency effect on thermal fatigue damage in CU interconnects

MPS-Authors
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Park,  Y.-B.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Mönig,  R.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Volkert,  C. A.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Park, Y.-B., Mönig, R., & Volkert, C. A. (2006). Frequency effect on thermal fatigue damage in CU interconnects. TMS 2005 - Mechanical Behaviour of Thin films and Small Structures, TMS Symposium 2005 Mechanical Behaviour of Thin Films, 3253-3258.


Cite as: https://hdl.handle.net/11858/00-001M-0000-0010-4618-0
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