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The microstructure and state of stress of Sn thin films after post-plating annealing; an explanation for the suppression of whisker formation?

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http://pubman.mpdl.mpg.de/cone/persons/resource/persons76125

Sobiech,  M.
Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society;

http://pubman.mpdl.mpg.de/cone/persons/resource/persons76284

Welzel,  U.
Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society;

http://pubman.mpdl.mpg.de/cone/persons/resource/persons76084

Schuster,  R.
Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society;

http://pubman.mpdl.mpg.de/cone/persons/resource/persons75858

Mittemeijer,  E. J.
Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society;
Universität Stuttgart, Institut für Materialwissenschaft;

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Sobiech, M., Welzel, U., Schuster, R., Mittemeijer, E. J., Hügel, W., Seekamp, A., et al. (2007). The microstructure and state of stress of Sn thin films after post-plating annealing; an explanation for the suppression of whisker formation? In R. Bonda (Ed.), 2007 IEEE Electronic Components & Technology Conference, ECTC '07. Proceedings (pp. 192-197). Piscataway, NJ: IEEE Service Center.


Cite as: http://hdl.handle.net/11858/00-001M-0000-0010-43EC-C
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