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Reflow ageing influences and wettability effects of immersion tin final finishes with lead-free solder

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http://pubman.mpdl.mpg.de/cone/persons/resource/persons75946

Phillipp,  F.
Stuttgart Center for Electron Microscopy, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Hetschel, T., Wolter, K.-J., & Phillipp, F. (2009). Reflow ageing influences and wettability effects of immersion tin final finishes with lead-free solder. Circuit World, 35(2), 37-44. doi:10.1108/03056120910953303.


Cite as: http://hdl.handle.net/11858/00-001M-0000-0010-3DE6-B
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