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Temperature-dependent interfacial stiffness of the disorder layer in a thin Cu3Au alloy film

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http://pubman.mpdl.mpg.de/cone/persons/resource/persons75447

Ern,  C.
Dept. Metastable and Low-Dimensional Materials, Max Planck Institute for Intelligent Systems, Max Planck Society;

http://pubman.mpdl.mpg.de/cone/persons/resource/persons75413

Donner,  W.
Dept. Metastable and Low-Dimensional Materials, Max Planck Institute for Intelligent Systems, Max Planck Society;

http://pubman.mpdl.mpg.de/cone/persons/resource/persons75415

Dosch,  H.
Dept. Metastable and Low-Dimensional Materials, Max Planck Institute for Intelligent Systems, Max Planck Society;
Universität Stuttgart, Institut für Theoretische und Angewandte Physik;

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Citation

Ern, C., Donner, W., Dosch, H., Adams, B., & Nowikow, D. (2000). Temperature-dependent interfacial stiffness of the disorder layer in a thin Cu3Au alloy film. Physical Review Letters, 85, 1926-1929.


Cite as: http://hdl.handle.net/11858/00-001M-0000-0010-378E-0
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