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In situ transmission electron microscopy study of thermal-stress-induced dislocations in a thin Cu film constrained by a Si substrate

MPS-Authors
http://pubman.mpdl.mpg.de/cone/persons/resource/persons75388

Dehm,  G.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

http://pubman.mpdl.mpg.de/cone/persons/resource/persons76278

Weiss,  D.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

http://pubman.mpdl.mpg.de/cone/persons/resource/persons75228

Arzt,  E.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;
Universität Stuttgart, Institut für Metallkunde;

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Citation

Dehm, G., Weiss, D., & Arzt, E. (2001). In situ transmission electron microscopy study of thermal-stress-induced dislocations in a thin Cu film constrained by a Si substrate. Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing, 309-310, 468-472.


Cite as: http://hdl.handle.net/11858/00-001M-0000-0010-3492-D
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