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Interconnect Failure due to Cyclic Loading

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Mönig,  R.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Volkert,  C. A.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Arzt,  E.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;
Universität Stuttgart, Institut für Metallkunde;

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Schwaiger,  R.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Kraft,  O.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Citation

Keller, R. R., Mönig, R., Volkert, C. A., Arzt, E., Schwaiger, R., & Kraft, O. (2002). Interconnect Failure due to Cyclic Loading. In S. Baker, M. Korhonen, E. Arzt, & P. Ho (Eds.), Stress Induced Phenomena in Metallization: Proceedings of the Sixth International Workshop on Stress Induced Phenomena in Metallization (pp. 119-132). Melville, N.Y.: AIP.


Cite as: https://hdl.handle.net/11858/00-001M-0000-0010-32BD-0
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