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Interface of directly bonded InP wafers for vertical couplers

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Jin-Phillipp,  N. Y.
Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society;
Dept. Metastable and Low-Dimensional Materials, Max Planck Institute for Intelligent Systems, Max Planck Society;
Stuttgart Center for Electron Microscopy, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Kelsch,  M.
Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society;
Stuttgart Center for Electron Microscopy, Max Planck Institute for Intelligent Systems, Max Planck Society;

/persons/resource/persons76195

Thomas,  J.
Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society;
Dept. Metastable and Low-Dimensional Materials, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Rühle,  M.
Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Citation

Jin-Phillipp, N. Y., Liu, B., Bowers, J. E., Hu, E. L., Kelsch, M., Thomas, J., et al. (2002). Interface of directly bonded InP wafers for vertical couplers. Applied Physics Letters, 80(8), 1346-1348.


Cite as: https://hdl.handle.net/11858/00-001M-0000-0010-31FD-8
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