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Journal Article

Bonding between Cu and α-Al2O3

MPS-Authors
http://pubman.mpdl.mpg.de/cone/persons/resource/persons75482

Gao,  M.
Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society;

http://pubman.mpdl.mpg.de/cone/persons/resource/persons76047

Scheu,  C.
Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society;

http://pubman.mpdl.mpg.de/cone/persons/resource/persons76249

Wagner,  T.
Central Scientific Facility Thin Film Laboratory, Max Planck Institute for Intelligent Systems, Max Planck Society;

http://pubman.mpdl.mpg.de/cone/persons/resource/persons75741

Kurtz,  W.
Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society;

http://pubman.mpdl.mpg.de/cone/persons/resource/persons76016

Rühle,  M.
Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Citation

Gao, M., Scheu, C., Wagner, T., Kurtz, W., & Rühle, M. (2002). Bonding between Cu and α-Al2O3. Zeitschrift für Metallkunde, 93(5), 438-443.


Cite as: http://hdl.handle.net/11858/00-001M-0000-0010-3168-7
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