Spatially resolved characterization of electromigration-induced plastic 
deformation in Al(0.5wt% Cu) interconnect

Barabash, R. I.; Ice, G. E.; Tamura, N.; Valek, B. C.; Spolenak, R.; Patel, R.

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Spatially resolved characterization of electromigration-induced plastic deformation in Al(0.5wt% Cu) interconnect

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Spolenak, R.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Barabash, R. I., Ice, G. E., Tamura, N., Valek, B. C., Spolenak, R., & Patel, R. (2003). Spatially resolved characterization of electromigration-induced plastic deformation in Al(0.5wt% Cu) interconnect. In J. Pinqueras (Ed.), Spatially Resolved Characterization of Local Phenomena in Materials and Nanostructures (pp. G13.1.1-G13.1.6). Warrendale, Pa.: MRS.

Cite as: https://hdl.handle.net/11858/00-001M-0000-0010-2E04-B

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