Mechanical stress evolution in metal interconnects for various line aspect 
ratios and passivation dielectrics

Park, Y. B.; Jeon, I. S.

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Mechanical stress evolution in metal interconnects for various line aspect ratios and passivation dielectrics

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Park, Y. B.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Park, Y. B., & Jeon, I. S. (2003). Mechanical stress evolution in metal interconnects for various line aspect ratios and passivation dielectrics. Microelectronic Engineering, 69(1), 26-36.

Cite as: https://hdl.handle.net/11858/00-001M-0000-0010-2C6E-D

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