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Influence of tantalum and silver interlayers on thermal stress evolution in copper thin films on silicon substrates

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Schmidt,  T. K.
Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society;
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Balk,  T. J.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Dehm,  G.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Arzt,  E.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;
Universität Stuttgart, Institut für Metallkunde;

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Citation

Schmidt, T. K., Balk, T. J., Dehm, G., & Arzt, E. (2004). Influence of tantalum and silver interlayers on thermal stress evolution in copper thin films on silicon substrates. Scripta Materialia, 50, 733-737.


Cite as: https://hdl.handle.net/11858/00-001M-0000-0010-2BD6-9
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