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Journal Article

Manipulating bonding at a Cu/(0001)Al2O3 interface by different substrate cleaning processes

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Scheu,  C.
Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Scheu, C. (2004). Manipulating bonding at a Cu/(0001)Al2O3 interface by different substrate cleaning processes. Interface Science, 12, 127-134.


Cite as: https://hdl.handle.net/11858/00-001M-0000-0010-2B2A-F
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