Damage behavior of 200-nm thin copper films under cyclic loading

Zhang, G. P.; Volkert, C. A.; Schwaiger, R.; Arzt, E.; Kraft, O.

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Damage behavior of 200-nm thin copper films under cyclic loading

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Zhang, G. P.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Volkert, C. A.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Schwaiger, R.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Arzt, E.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;
Universität Stuttgart, Institut für Metallkunde;

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Kraft, O.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Zhang, G. P., Volkert, C. A., Schwaiger, R., Arzt, E., & Kraft, O. (2005). Damage behavior of 200-nm thin copper films under cyclic loading. Journal of Materials Research, 20(1), 201-207.

Cite as: https://hdl.handle.net/11858/00-001M-0000-0010-2704-1

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