Electro-deposition as a repair method for embedded metal grids

Oostra, A. J.; Reddy, A.; Smits, E. C. P.; Abbel, R.; Groen, W. A.; Blom, Paul W. M.; Michels, Jasper J.

doi:10.1016/j.tsf.2016.01.060

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Electro-deposition as a repair method for embedded metal grids

Oostra, A. J., Reddy, A., Smits, E. C. P., Abbel, R., Groen, W. A., Blom, P. W. M., et al. (2016). Electro-deposition as a repair method for embedded metal grids. Thin Solid Films, 603, 202-205. doi:10.1016/j.tsf.2016.01.060.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-002A-3F4E-B Version Permalink: https://hdl.handle.net/11858/00-001M-0000-002A-3F4F-9

Genre: Journal Article

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Creators:
Oostra, A. J., Author
Reddy, A., Author
Smits, E. C. P., Author
Abbel, R., Author
Groen, W. A., Author
Blom, Paul W. M.¹, Author
Michels, Jasper J.¹, Author

Affiliations:
1Dept. Blom: Molecular Electronics, MPI for Polymer Research, Max Planck Society, ou_1800284

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Language(s): eng - English

Dates: Date issued: 2016

Publication Status: Issued

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Identifiers: DOI: 10.1016/j.tsf.2016.01.060

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Title: Thin Solid Films

Abbreviation : Thin Solid Films

Source Genre: Journal

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Publ. Info: Lausanne, Switzerland, etc. : Elsevier

Pages: - Volume / Issue: 603 Sequence Number: - Start / End Page: 202 - 205 Identifier: ISSN: 0040-6090
CoNE: https://pure.mpg.de/cone/journals/resource/954925449792