Quantitative characterization of electromigration-induced plastic deformation 
in Al(0.5wt%Cu) interconnect

Barabash, R. I.; Ice, G. E.; Tamura, N.; Valek, B. C.; Bravman, J. C.; Spolenak, R.; Patel, J. R.

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Quantitative characterization of electromigration-induced plastic deformation in Al(0.5wt%Cu) interconnect

Barabash, R. I., Ice, G. E., Tamura, N., Valek, B. C., Bravman, J. C., Spolenak, R., et al. (2004). Quantitative characterization of electromigration-induced plastic deformation in Al(0.5wt%Cu) interconnect. Microelectronic Engineering, 75(1), 24-30.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-2902-6 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-2903-4

Genre: Journal Article

Alternative Title : Microelectron. Eng.

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Creators:
Barabash, R. I., Author
Ice, G. E., Author
Tamura, N., Author
Valek, B. C., Author
Bravman, J. C., Author
Spolenak, R.¹, Author
Patel, J. R., Author

Affiliations:
1Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655

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Free keywords: MPI für Metallforschung; Abt. Arzt;

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Language(s): eng - English

Dates: Date issued: 2004-07

Publication Status: Issued

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Rev. Type: Peer

Identifiers: eDoc: 200784

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Title: Microelectronic Engineering

Alternative Title : Microelectron. Eng.

Source Genre: Journal

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Pages: - Volume / Issue: 75 (1) Sequence Number: - Start / End Page: 24 - 30 Identifier: -