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  Phase formation at the Sn/Cu interface during room temperature aging: microstructural evolution, whiskering, and interface thermodynamics

Sobiech, M., Krüger, C., Welzel, U., Wang, J. Y., Mittemeijer, E. J., & Hügel, W. (2011). Phase formation at the Sn/Cu interface during room temperature aging: microstructural evolution, whiskering, and interface thermodynamics. Journal of Materials Research, 26, 1482-1493. doi:10.1557/jmr.2011.162.

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 Creators:
Sobiech, M.1, Author           
Krüger, C.1, Author           
Welzel, U.1, Author           
Wang, J. Y.1, Author           
Mittemeijer, E. J.1, 2, Author           
Hügel, W.3, Author
Affiliations:
1Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497644              
2Universität Stuttgart, Institut für Materialwissenschaft, ou_persistent22              
3Max Planck Society, ou_persistent13              

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Free keywords: MPI für Intelligente Systeme; Abt. Mittemeijer;
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Language(s): eng - English
 Dates: 2011
 Publication Status: Issued
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: Peer
 Identifiers: eDoc: 579766
DOI: 10.1557/jmr.2011.162
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Title: Journal of Materials Research
Source Genre: Journal
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Publ. Info: -
Pages: - Volume / Issue: 26 Sequence Number: - Start / End Page: 1482 - 1493 Identifier: -