Sobiech, M., Teufel, J., Welzel, U., Mittemeijer, E. J., & Hügel, W. (2011). Stress relaxation mechanisms of Sn and SnPb coatings electrodeposited on Cu: avoidance of whiskering. Journal of Electronic Materials, 40(11), 2300-2313. doi:10.1007/s11664-011-1737-3.