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  Stress relaxation mechanisms of Sn and SnPb coatings electrodeposited on Cu: avoidance of whiskering

Sobiech, M., Teufel, J., Welzel, U., Mittemeijer, E. J., & Hügel, W. (2011). Stress relaxation mechanisms of Sn and SnPb coatings electrodeposited on Cu: avoidance of whiskering. Journal of Electronic Materials, 40(11), 2300-2313. doi:10.1007/s11664-011-1737-3.

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 Creators:
Sobiech, M.1, Author           
Teufel, J.1, Author           
Welzel, U.1, Author           
Mittemeijer, E. J.1, 2, Author           
Hügel, W.3, Author
Affiliations:
1Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497644              
2Universität Stuttgart, Institut für Materialwissenschaft, ou_persistent22              
3Robert Bosch GmbH, Dieselstr. 6, 72770 Reutlingen, Germany;Institute for Materials Science, University of Stuttgart, Heisenbergstr. 3, 70569 Stuttgart, Germany, ou_persistent22              

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Free keywords: MPI für Intelligente Systeme; Abt. Schütz; Abt. Mittemeijer;
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Language(s): eng - English
 Dates: 2011
 Publication Status: Issued
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: Peer
 Identifiers: eDoc: 573305
DOI: 10.1007/s11664-011-1737-3
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Title: Journal of Electronic Materials
Source Genre: Journal
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Publ. Info: -
Pages: - Volume / Issue: 40 (11) Sequence Number: - Start / End Page: 2300 - 2313 Identifier: -