Bonding at copper-alumina interfaces established by different surface 
treatments: a critical review

Scheu, C.; Gao, M.; Oh, S. H.; Dehm, G.; Klein, S.; Tomsia, A. P.; Rühle, M.

doi:101007/s10853-006-0073-0

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Bonding at copper-alumina interfaces established by different surface treatments: a critical review

Scheu, C., Gao, M., Oh, S. H., Dehm, G., Klein, S., Tomsia, A. P., et al. (2006). Bonding at copper-alumina interfaces established by different surface treatments: a critical review. Journal of Materials Science, 41(16), 5161-5168. doi:101007/s10853-006-0073-0.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-487E-9 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-487F-7

Genre: Journal Article

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Creators:
Scheu, C.¹, Author
Gao, M.¹, Author
Oh, S. H.¹, Author
Dehm, G.², Author
Klein, S.¹, Author
Tomsia, A. P.¹, Author
Rühle, M.³, Author

Affiliations:
1Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497657
2Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655
3Emeriti and Others, Max Planck Institute for Intelligent Systems, Max Planck Society, DE, ou_1497650

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Free keywords: MPI für Metallforschung; Emeriti and Others; Stuttgart Center for Electron Microscopy (StEM);

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Language(s): eng - English

Dates: Date issued: 2006

Publication Status: Issued

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Rev. Type: Peer

Identifiers: eDoc: 318166
DOI: 101007/s10853-006-0073-0

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Title: Journal of Materials Science

Source Genre: Journal

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Pages: - Volume / Issue: 41 (16) Sequence Number: - Start / End Page: 5161 - 5168 Identifier: -