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  Passivation effects in copper thin films

Wiederhirn, G., Balk, T. J., Dehm, G., Nucci, J., Richter, G., & Arzt, E. (2006). Passivation effects in copper thin films. In E. Zschech, K. Maex, P. S. Ho, H. Kawasaki, & a. T. Nakamura (Eds.), Stress-Induced Phenomena in Metallization (pp. 185-191). Melville, N.Y.: AIP.

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 Creators:
Wiederhirn, G.1, Author           
Balk, T. J.1, Author           
Dehm, G.1, Author           
Nucci, J.1, Author           
Richter, G.2, Author           
Arzt, E.1, 3, Author           
Affiliations:
1Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655              
2Central Scientific Facility Thin Film Laboratory, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497640              
3Universität Stuttgart, Institut für Metallkunde, ou_persistent22              

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Free keywords: MPI für Metallforschung; Abt. Arzt; ZWE Dünnschichtlabor; thin films mechanics, passivation, thermomechanical behavior
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Language(s): eng - English
 Dates: 2006
 Publication Status: Issued
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: -
 Identifiers: eDoc: 282459
 Degree: -

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Title: Stress-Induced Phenomena in Metallization. 8th International Workshop
Place of Event: Dresden
Start-/End Date: 2005-09-12 - 2005-09-14

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Title: Stress-Induced Phenomena in Metallization
Source Genre: Proceedings
 Creator(s):
Zschech, E., Editor
Maex, K., Editor
Ho, P. S., Editor
Kawasaki, H., Editor
Nakamura, and T., Editor
Affiliations:
-
Publ. Info: Melville, N.Y. : AIP
Pages: - Volume / Issue: - Sequence Number: - Start / End Page: 185 - 191 Identifier: -

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Title: AIP conference proceedings
Source Genre: Series
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Publ. Info: -
Pages: - Volume / Issue: 817 Sequence Number: - Start / End Page: - Identifier: -