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  Fatigue damage in thin film Al interconnects at ultra high frequency: A finite element analysis approach

Eberl, C., Spolenak, R., Kraft, O., Ruile, W., & Arzt, E. (2006). Fatigue damage in thin film Al interconnects at ultra high frequency: A finite element analysis approach. Thin Solid Films, 515, 3291-3297.

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 Creators:
Eberl, C.1, Author           
Spolenak, R.1, Author           
Kraft, O.1, Author           
Ruile, W.2, Author
Arzt, E.1, 3, Author           
Affiliations:
1Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655              
2Johns Hopkins University, Whitening School of Engineering,Baltimore, MD/USA; ETH Zürich, Nanolab, Department of Materials, Zürich, Switzerland; Forschungszentrum Karlsruhe, Institut für Materialforschung II, Karlsruhe, Germany; Universität Stuttgart, Institut für Zuverlässigkeit von Bauteilen und Systemen, Karlsruhe, Germany; EPCOS AG, München, Germany, ou_persistent22              
3Universität Stuttgart, Institut für Metallkunde, ou_persistent22              

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Free keywords: MPI für Metallforschung; Abt. Arzt;
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Language(s): eng - English
 Dates: 2006-02-24
 Publication Status: Issued
 Pages: -
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 Table of Contents: -
 Rev. Type: Peer
 Identifiers: eDoc: 319096
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Title: Thin Solid Films
Source Genre: Journal
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Pages: - Volume / Issue: 515 Sequence Number: - Start / End Page: 3291 - 3297 Identifier: -