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  Interdiffusion and stress development in Cu-Pd thin film diffusion couples.

Kuru, Y., Wohlschlögel, M., Welzel, U., & Mittemeijer, E. J. (2008). Interdiffusion and stress development in Cu-Pd thin film diffusion couples. Thin Solid Films, 516, 7615-7626.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-4195-F Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-4196-D
Genre: Journal Article

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 Creators:
Kuru, Y.1, Author           
Wohlschlögel, M.1, Author           
Welzel, U.1, Author           
Mittemeijer, E. J.1, 2, Author           
Affiliations:
1Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497644              
2Universität Stuttgart, Institut für Materialwissenschaft, ou_persistent22              

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Free keywords: MPI für Metallforschung; Abt. Mittemeijer;
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Language(s): eng - English
 Dates: 2008
 Publication Status: Issued
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 Rev. Type: Peer
 Identifiers: eDoc: 410490
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Title: Thin Solid Films
Source Genre: Journal
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Pages: - Volume / Issue: 516 Sequence Number: - Start / End Page: 7615 - 7626 Identifier: -