Reflow ageing influences and wettability effects of immersion tin final 
finishes with lead-free solder

Hetschel, T.; Wolter, K.-J.; Phillipp, F.

doi:10.1108/03056120910953303

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Reflow ageing influences and wettability effects of immersion tin final finishes with lead-free solder

Hetschel, T., Wolter, K.-J., & Phillipp, F. (2009). Reflow ageing influences and wettability effects of immersion tin final finishes with lead-free solder. Circuit World, 35(2), 37-44. doi:10.1108/03056120910953303.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-3DE6-B Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-3DE7-9

Genre: Journal Article

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Creators:
Hetschel, T.¹, Author
Wolter, K.-J.¹, Author
Phillipp, F.², Author

Affiliations:
1Robert Bosch GmbH, Stuttgart, Germany;Electronic Packaging Laboratory, Dresden University of Technology, Dresden, Germany., ou_persistent22
2Stuttgart Center for Electron Microscopy, Max Planck Institute for Intelligent Systems, Max Planck Society, DE, ou_1497669

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Free keywords: MPI für Metallforschung; Stuttgart Center for Electron Microscopy (StEM);

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Language(s): eng - English

Dates: Date issued: 2009

Publication Status: Issued

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Identifiers: eDoc: 432294
DOI: 10.1108/03056120910953303

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Title: Circuit World

Source Genre: Journal

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Pages: - Volume / Issue: 35 (2) Sequence Number: - Start / End Page: 37 - 44 Identifier: -