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  Development of Cu/Cu interconnections using an indium interlayer

Sommadossi, S., Khanna, P. K., Bhatnagar, S. K., Litynska, L., Zieba, P., Gust, W., et al. (2000). Development of Cu/Cu interconnections using an indium interlayer. In B. Jouffray, & J. Svejcar (Eds.), Euromat 99. 6th European Congress on Advanced Materials and Processes. Vol. 4 (pp. 214-218). Weinheim: Wiley-VCH.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-3959-5 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-395A-3
Genre: Conference Paper

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 Creators:
Sommadossi, S.1, Author           
Khanna, P. K., Author
Bhatnagar, S. K., Author
Litynska, L., Author
Zieba, P., Author
Gust, W.1, Author           
Mittemeijer, E. J.1, 2, Author           
Affiliations:
1Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497644              
2Universität Stuttgart, Institut für Materialwissenschaft, ou_persistent22              

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Free keywords: MPI für Metallforschung; Abt. Mittemeijer;
 Abstract: -

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Language(s): eng - English
 Dates: 2000
 Publication Status: Issued
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: -
 Identifiers: eDoc: 200662
 Degree: -

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Title: EUROMAT 99, 6th European Congress on Advanced Materials and Processes
Place of Event: München
Start-/End Date: 1999-09-27 - 1999-09-30

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Title: Euromat 99. 6th European Congress on Advanced Materials and Processes. Vol. 4
Source Genre: Proceedings
 Creator(s):
Jouffray, B., Editor
Svejcar, J., Editor
Affiliations:
-
Publ. Info: Weinheim : Wiley-VCH
Pages: - Volume / Issue: - Sequence Number: - Start / End Page: 214 - 218 Identifier: -