Temperature-dependent interfacial stiffness of the disorder layer in a thin Cu3
Au alloy film

Ern, C.; Donner, W.; Dosch, H.; Adams, B.; Nowikow, D.

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Temperature-dependent interfacial stiffness of the disorder layer in a thin Cu₃Au alloy film

Ern, C., Donner, W., Dosch, H., Adams, B., & Nowikow, D. (2000). Temperature-dependent interfacial stiffness of the disorder layer in a thin Cu₃Au alloy film. Physical Review Letters, 85, 1926-1929.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-378E-0 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-378F-E

Genre: Journal Article

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Creators:
Ern, C.¹, Author
Donner, W.¹, Author
Dosch, H.^{1, 2}, Author
Adams, B., Author
Nowikow, D., Author

Affiliations:
1Dept. Metastable and Low-Dimensional Materials, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497645
2Universität Stuttgart, Institut für Theoretische und Angewandte Physik, ou_persistent22

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Free keywords: MPI für Metallforschung; Abt. Dosch;

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Language(s): eng - English

Dates: Date issued: 2000

Publication Status: Issued

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Rev. Type: Peer

Identifiers: eDoc: 43788

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Title: Physical Review Letters

Source Genre: Journal

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Pages: - Volume / Issue: 85 Sequence Number: - Start / End Page: 1926 - 1929 Identifier: -