In-situ TEM study of thermal-stress induced dislocations in a Cu thin film on a 
SiNx coated Si-substracte

Dehm, G.; Arzt, E.

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In-situ TEM study of thermal-stress induced dislocations in a Cu thin film on a SiN_x coated Si-substracte

Dehm, G., & Arzt, E. (2000). In-situ TEM study of thermal-stress induced dislocations in a Cu thin film on a SiN_x coated Si-substracte. In J. Gemperlova, & I. Vavra (Eds.), Proceedings of the 12th European Congress on Electron Microscopy. Vol. 2: Physical Sciences (pp. 523-524). Czechoslovak Society for Electron Microscopy.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-3776-4 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-3777-2

Genre: Conference Paper

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Creators:
Dehm, G.¹, Author
Arzt, E.^{1, 2}, Author

Affiliations:
1Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655
2Universität Stuttgart, Institut für Metallkunde, ou_persistent22

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Free keywords: MPI für Metallforschung; Abt. Arzt;

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Language(s): eng - English

Dates: Date issued: 2000

Publication Status: Issued

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Identifiers: eDoc: 43722

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Title: 12th European Congress on Electron Microscopy (EUREM2000)

Place of Event: Brno [Czech Republic]

Start-/End Date: 2000-07-09 - 2000-07-14

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Title: Proceedings of the 12th European Congress on Electron Microscopy. Vol. 2: Physical Sciences

Source Genre: Proceedings

Creator(s):
Gemperlova, J., Editor
Vavra, I., Editor

Affiliations:
-

Publ. Info: Czechoslovak Society for Electron Microscopy

Pages: - Volume / Issue: - Sequence Number: - Start / End Page: 523 - 524 Identifier: -