Crack-tip field analyses of silicon using order (N) tight-binding method

Kugimiya, T.; Shibutani, Y.; Gumbsch, P.

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Crack-tip field analyses of silicon using order (N) tight-binding method

Kugimiya, T., Shibutani, Y., & Gumbsch, P. (2001). Crack-tip field analyses of silicon using order (N) tight-binding method. In Materials Science for the 21st Century. Vol. B (pp. 285-288).

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-36BE-C Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-36BF-A

Genre: Conference Paper

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Creators:
Kugimiya, T., Author
Shibutani, Y., Author
Gumbsch, P.¹, Author

Affiliations:
1Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655

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Free keywords: MPI für Metallforschung; Abt. Arzt;

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Language(s): eng - English

Dates: Date issued: 2001

Publication Status: Issued

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Identifiers: eDoc: 41455

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Title: Materials Science for the 21st Century

Place of Event: Osaka, Japan

Start-/End Date: 2001-05-21 - 2001-05-26

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Title: Materials Science for the 21st Century. Vol. B

Source Genre: Proceedings

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Pages: - Volume / Issue: - Sequence Number: - Start / End Page: 285 - 288 Identifier: -