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  Interface of directly bonded GaAs and InP

Jin-Phillipp, N. Y., Sigle, W., Black, A., Babic, D., Bowers, J. E., Hu, E. L., et al. (2001). Interface of directly bonded GaAs and InP. Journal of Applied Physics, 89(2), 1017-1024.

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Genre: Journal Article
Alternative Title : J. Appl. Phys.

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 Creators:
Jin-Phillipp, N. Y.1, 2, 3, Author           
Sigle, W.1, 3, Author           
Black, A.4, Author
Babic, D.4, Author
Bowers, J. E.4, Author
Hu, E. L.4, Author
Rühle, M.1, Author           
Affiliations:
1Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497657              
2Dept. Metastable and Low-Dimensional Materials, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497645              
3Stuttgart Center for Electron Microscopy, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497669              
4Univ Calif Santa Barbara, QUEST, Santa Barbara, CA 93106 USA; Agilent Labs, Palo Alto, CA 94304 USA, ou_persistent22              

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Free keywords: MPI für Metallforschung; Abt. Rühle;
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Language(s): eng - English
 Dates: 2001-01-15
 Publication Status: Issued
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: Peer
 Identifiers: eDoc: 21807
ISI: 000166144400030
 Degree: -

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Title: Journal of Applied Physics
  Alternative Title : J. Appl. Phys.
Source Genre: Journal
 Creator(s):
Affiliations:
Publ. Info: -
Pages: - Volume / Issue: 89 (2) Sequence Number: - Start / End Page: 1017 - 1024 Identifier: ISSN: 0021-8979