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  Thermomechanical behavior of different texture components in Cu thin films

Baker, S. P., Kretschmann, A., & Arzt, E. (2001). Thermomechanical behavior of different texture components in Cu thin films. Acta Materialia, 49(12), 2145-2160.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-348D-C Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-348E-A
Genre: Journal Article
Alternative Title : Acta Mater.

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02-ar_2001.pdf (Abstract), 70KB
 
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 Creators:
Baker, S. P.1, Author
Kretschmann, A.1, Author
Arzt, E.2, 3, Author           
Affiliations:
1Cornell Univ, Dept Mat Sci & Engn, Bard Hall, Ithaca, NY 14853; USA; Univ Stuttgart, Max Planck Inst Met Forsch, D-70174 Stuttgart, Germany; Univ Stuttgart, Inst Met Kunde, D-70174 Stuttgart, Germany, ou_persistent22              
2Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655              
3Universität Stuttgart, Institut für Metallkunde, ou_persistent22              

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Free keywords: MPI für Metallforschung; Abt. Arzt; thin films; texture; copper; X-ray diffraction (XRD); stress distribution
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Language(s): eng - English
 Dates: 2001-07-17
 Publication Status: Issued
 Pages: -
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 Table of Contents: -
 Rev. Type: Peer
 Identifiers: eDoc: 21050
ISI: 000169811500004
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Title: Acta Materialia
  Alternative Title : Acta Mater.
Source Genre: Journal
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Pages: - Volume / Issue: 49 (12) Sequence Number: - Start / End Page: 2145 - 2160 Identifier: ISSN: 1359-6454