Constrained diffusional creep in UHV-produced copper thin films

Weiss, D.; Gao, H.; Arzt, E.

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Constrained diffusional creep in UHV-produced copper thin films

Weiss, D., Gao, H., & Arzt, E. (2001). Constrained diffusional creep in UHV-produced copper thin films. Acta Materialia, 49(13), 2395-2403.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-3463-8 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-3464-6

Genre: Journal Article

Alternative Title : Acta Mater.

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41-ar_2001.pdf (Abstract), 57KB

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Creators:
Weiss, D.¹, Author
Gao, H.², Author
Arzt, E.^{1, 3}, Author

Affiliations:
1Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655
2Former Dept. Theory of Mesoscopic Phenomena, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497656
3Universität Stuttgart, Institut für Metallkunde, ou_persistent22

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Free keywords: MPI für Metallforschung; Abt. Arzt; Ehem. Abt. Gao; copper; aluminum; mechanical properties; creep; thin films

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Language(s): eng - English

Dates: Date issued: 2001-08-01

Publication Status: Issued

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Rev. Type: Peer

Identifiers: eDoc: 20995
ISI: 000170159500005

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Title: Acta Materialia

Alternative Title : Acta Mater.

Source Genre: Journal

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Pages: - Volume / Issue: 49 (13) Sequence Number: - Start / End Page: 2395 - 2403 Identifier: ISSN: 1359-6454