Deformation behavior of thin copper films on deformable substrates

Hommel, M.; Kraft, O.

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Deformation behavior of thin copper films on deformable substrates

Hommel, M., & Kraft, O. (2001). Deformation behavior of thin copper films on deformable substrates. Acta Materialia, 49(19), 3935-3947.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-33DB-6 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-33DC-4

Genre: Journal Article

Alternative Title : Acta Mater.

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16-ar_2001.pdf (Abstract), 55KB

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Creators:
Hommel, M.¹, Author
Kraft, O.¹, Author

Affiliations:
1Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655

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Free keywords: MPI für Intelligente Systeme; Ehemalige Abt. Arzt; metals; thin films; stress-strain relationship measurements; strain hardening

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Language(s): eng - English

Dates: Date issued: 2001-11-14

Publication Status: Issued

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Rev. Type: Peer

Identifiers: eDoc: 20433
ISI: 000172241100004

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Title: Acta Materialia

Alternative Title : Acta Mater.

Source Genre: Journal

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Pages: - Volume / Issue: 49 (19) Sequence Number: - Start / End Page: 3935 - 3947 Identifier: ISSN: 1359-6454