English
 
Help Privacy Policy Disclaimer
  Advanced SearchBrowse

Item

ITEM ACTIONSEXPORT
 
 
DownloadE-Mail
 Local TagsRelease HistoryDetailsSummary
  Changes in stress and microstructure in sputter deposited copper films due to substrate surface effects

Okolo, B., Lamparter, P., Welzel, U., Wagner, T., & Mittemeijer, E. J. (2002). Changes in stress and microstructure in sputter deposited copper films due to substrate surface effects. In A. Dias, J. Pina, A. Battista, & E. Diogo (Eds.), Proceedings of the 6th European Conference on Residual Stresses (pp. 691-696). Uetikon-Zürich: Trans Tech Publications Ltd.

Item is

 

show all hide all

Basic

show hide
Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-3274-1 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-3275-0
Genre: Conference Paper

Files

show Files
hide Files
:
42-ar_2002.pdf (Abstract), 67KB
 
File Permalink:
-
Name:
42-ar_2002.pdf
Description:
-
OA-Status:
Visibility:
Restricted (Max Planck Institute for Intelligent Systems, MSMT; )
MIME-Type / Checksum:
application/pdf
Technical Metadata:
Copyright Date:
-
Copyright Info:
eDoc_access: INSTITUT
License:
-

Locators

show

Creators

show
hide
 Creators:
Okolo, B.1, Author           
Lamparter, P.1, Author           
Welzel, U.1, Author           
Wagner, T.2, Author           
Mittemeijer, E. J.1, 3, Author           
Affiliations:
1Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497644              
2Central Scientific Facility Thin Film Laboratory, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497640              
3Universität Stuttgart, Institut für Materialwissenschaft, ou_persistent22              

Content

show
hide
Free keywords: MPI für Metallforschung; Abt. Mittemeijer; Abt. Arzt; ZWE Dünnschichtlabor; 42-ar_2002; 19-mi_2002; Cu films; coalescence; microstructure; stress; substrate surface roughness
 Abstract: -

Details

show
hide
Language(s): eng - English
 Dates: 2002
 Publication Status: Issued
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: Peer
 Identifiers: eDoc: 6743
ISI: 000177256900107
 Degree: -

Event

show
hide
Title: 6th European Conference on Residual Stresses (ECRS 6)
Place of Event: Coimbra, Portugal
Start-/End Date: 2002-07-10 - 2002-07-12

Legal Case

show

Project information

show

Source 1

show
hide
Title: Proceedings of the 6th European Conference on Residual Stresses
Source Genre: Proceedings
 Creator(s):
Dias, A.M., Editor
Pina, J., Editor
Battista, A.C., Editor
Diogo, E., Editor
Affiliations:
-
Publ. Info: Uetikon-Zürich : Trans Tech Publications Ltd.
Pages: - Volume / Issue: - Sequence Number: - Start / End Page: 691 - 696 Identifier: -

Source 2

show
hide
Title: Materials Science Forum
Source Genre: Series
 Creator(s):
Affiliations:
Publ. Info: -
Pages: - Volume / Issue: - Sequence Number: - Start / End Page: - Identifier: ISSN: 0255-5476