Kinetic behaviour of diffusion-soldered Ni/Al/Ni interconnections

Lopez, G. A.; Sommadossi, S.; Zieba, P.; Gust, W.; Mittemeijer, E. J.

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Kinetic behaviour of diffusion-soldered Ni/Al/Ni interconnections

Lopez, G. A., Sommadossi, S., Zieba, P., Gust, W., & Mittemeijer, E. J. (2002). Kinetic behaviour of diffusion-soldered Ni/Al/Ni interconnections. Materials Chemistry and Physics, 78(2), 459-463.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-3203-1 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-3204-0

Genre: Journal Article

Alternative Title : Mater. Chem. Phys.

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Creators:
Lopez, G. A.¹, Author
Sommadossi, S.¹, Author
Zieba, P.², Author
Gust, W.¹, Author
Mittemeijer, E. J.^{1, 3}, Author

Affiliations:
1Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497644
2Univ Stuttgart, Max Planck Inst Met Res, Heisenbergstr3, D-70569 Stuttgart, Germany; Univ Stuttgart, Inst Met Phys, D-70569 Stuttgart, Germany; Polish Acad Sci, Inst Met & Mat Sci, PL-30059 Krakow, Poland, ou_persistent22
3Universität Stuttgart, Institut für Materialwissenschaft, ou_persistent22

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Free keywords: MPI für Metallforschung; Abt. Mittemeijer; diffusion soldering; isothermal solidification; Ni-Al system; intermetallic phases; interdiffusion coefficient

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Language(s): eng - English

Dates: Date issued: 2002-02-17

Publication Status: Issued

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Rev. Type: Peer

Identifiers: eDoc: 6644
ISI: 000179569300027

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Title: Materials Chemistry and Physics

Alternative Title : Mater. Chem. Phys.

Source Genre: Journal

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Pages: - Volume / Issue: 78 (2) Sequence Number: - Start / End Page: 459 - 463 Identifier: ISSN: 0254-0584