Interface of directly bonded InP wafers for vertical couplers

Jin-Phillipp, N. Y.; Liu, B.; Bowers, J. E.; Hu, E. L.; Kelsch, M.; Thomas, J.; Rühle, M.

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Interface of directly bonded InP wafers for vertical couplers

Jin-Phillipp, N. Y., Liu, B., Bowers, J. E., Hu, E. L., Kelsch, M., Thomas, J., et al. (2002). Interface of directly bonded InP wafers for vertical couplers. Applied Physics Letters, 80(8), 1346-1348.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-31FD-8 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-31FE-6

Genre: Journal Article

Alternative Title : Appl. Phys. Lett.

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Creators:
Jin-Phillipp, N. Y.^{1, 2, 3}, Author
Liu, B.⁴, Author
Bowers, J. E.⁴, Author
Hu, E. L.⁴, Author
Kelsch, M.^{1, 3}, Author
Thomas, J.^{1, 2}, Author
Rühle, M.¹, Author

Affiliations:
1Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497657
2Dept. Metastable and Low-Dimensional Materials, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497645
3Stuttgart Center for Electron Microscopy, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497669
4Max Planck Inst Festkorperforsch, Heisenbergstr 1, D-70569; Stuttgart, Germany; Univ Calif Santa Barbara, Dept Elect & Comp Engn, Santa Barbara, CA 93106 USA;, ou_persistent22

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Free keywords: MPI für Metallforschung; MPI für Metallforschung; Abt. Rühle; Abt. Rühle; ZWE Hochspannungs-Mikroskopie; 25-ru_2002;

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Language(s): eng - English

Dates: Date issued: 2002-02-25

Publication Status: Issued

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Rev. Type: Peer

Identifiers: eDoc: 6921
ISI: 000174009800010

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Title: Applied Physics Letters

Alternative Title : Appl. Phys. Lett.

Source Genre: Journal

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Pages: - Volume / Issue: 80 (8) Sequence Number: - Start / End Page: 1346 - 1348 Identifier: ISSN: 0003-6951