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  Grain-boundary voiding in self-passivated Cu-1 at.% Al alloy films on Si substrates

Weiss, D., Kraft, O., & Arzt, E. (2002). Grain-boundary voiding in self-passivated Cu-1 at.% Al alloy films on Si substrates. Journal of Materials Research, 17(6), 1363-1370.

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Genre: Journal Article
Alternative Title : J. Mater. Res.

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22-ar_2002.pdf (Abstract), 57KB
 
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 Creators:
Weiss, D.1, Author           
Kraft, O.1, Author           
Arzt, E.1, 2, Author           
Affiliations:
1Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655              
2Universität Stuttgart, Institut für Metallkunde, ou_persistent22              

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Free keywords: MPI für Metallforschung; Abt. Arzt; 22-ar_2002;
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Language(s): eng - English
 Dates: 2002-06
 Publication Status: Issued
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 Table of Contents: -
 Rev. Type: Peer
 Identifiers: eDoc: 6814
ISI: 000176032600020
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Title: Journal of Materials Research
  Alternative Title : J. Mater. Res.
Source Genre: Journal
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Pages: - Volume / Issue: 17 (6) Sequence Number: - Start / End Page: 1363 - 1370 Identifier: ISSN: 0884-2914