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  Growth of electromigration-induced hillocks in Al interconnects

Nucci, J. A., Straub, A., Bischoff, E., Arzt, E., & Volkert, C. A. (2002). Growth of electromigration-induced hillocks in Al interconnects. Journal of Materials Research, 17(10), 2727-2735.

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Genre: Journal Article
Alternative Title : J. Mater. Res.

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41-ar_2002.pdf (Abstract), 57KB
 
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 Creators:
Nucci, J. A.1, Author           
Straub, A.1, Author           
Bischoff, E.2, 3, Author           
Arzt, E.1, 4, Author           
Volkert, C. A.1, Author           
Affiliations:
1Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655              
2Former Central Scientific Facility Metallography, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497652              
3Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society, DE, ou_1497657              
4Universität Stuttgart, Institut für Metallkunde, ou_persistent22              

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Free keywords: MPI für Metallforschung; Abt. Arzt; Abt. Rühle; ZWE Metallographie; 41-ar_2002;
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Language(s): eng - English
 Dates: 2002-10
 Publication Status: Issued
 Pages: -
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 Table of Contents: -
 Rev. Type: Peer
 Identifiers: eDoc: 6693
ISI: 000178351400035
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Title: Journal of Materials Research
  Alternative Title : J. Mater. Res.
Source Genre: Journal
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Pages: - Volume / Issue: 17 (10) Sequence Number: - Start / End Page: 2727 - 2735 Identifier: ISSN: 0884-2914