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  Strained thin copper films as model catalysts in the materials gap

Girgsdies, F., Ressler, T., Wild, U., Wübben, T., Balk, T. J., Dehm, G., et al. (2005). Strained thin copper films as model catalysts in the materials gap. Catalysis Letters, 102(1-2), 91-97. doi:10.1007/s10562-005-5208-4.

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 Creators:
Girgsdies, F.1, Author
Ressler, T.1, Author
Wild, U.1, Author
Wübben, T.2, Author           
Balk, T. J.2, Author           
Dehm, G.2, Author           
Zhou, L.3, Author           
Günther, S.4, Author
Arzt, E.2, 5, Author           
Imbihl, R.4, Author
Schlögl, R.1, Author
Affiliations:
1Max Planck Society, ou_persistent13              
2Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655              
3Former Dept. Materials Synthesis and Microstructure Design, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497654              
4Institut für Physikalische Chemie und Elektrochemie, Universität Hannover, Callinstr. 3-3a, D-30167 Hannover, Germany; Department Chemie, Ludwig-Maximilians Universität München, Butenandtstr. 11E, D-81377 München, Germany, ou_persistent22              
5Universität Stuttgart, Institut für Metallkunde, ou_persistent22              

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Free keywords: MPI für Metallforschung; Fritz-Haber-Institut; Abt. Arzt;
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Language(s): eng - English
 Dates: 2005
 Publication Status: Issued
 Pages: -
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 Table of Contents: -
 Rev. Type: Peer
 Identifiers: eDoc: 241634
DOI: 10.1007/s10562-005-5208-4
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Title: Catalysis Letters
Source Genre: Journal
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Pages: - Volume / Issue: 102 (1-2) Sequence Number: - Start / End Page: 91 - 97 Identifier: -