English
 
Help Privacy Policy Disclaimer
  Advanced SearchBrowse

Item

ITEM ACTIONSEXPORT
  Microstructural development of Sn-Ag-Cu solder joints

Fix, A. R., López, G. A., Brauer, I., Nüchter, W., & Mittemeijer, E. J. (2005). Microstructural development of Sn-Ag-Cu solder joints. Journal of Electronic Materials, 34, 137-142.

Item is

Files

show Files

Locators

show

Creators

show
hide
 Creators:
Fix, A. R.1, Author           
López, G. A.1, Author           
Brauer, I., Author
Nüchter, W., Author
Mittemeijer, E. J.1, 2, Author           
Affiliations:
1Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497644              
2Universität Stuttgart, Institut für Materialwissenschaft, ou_persistent22              

Content

show
hide
Free keywords: MPI für Metallforschung; Abt. Mittemeijer;
 Abstract: -

Details

show
hide
Language(s): eng - English
 Dates: 2005
 Publication Status: Issued
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: -
 Identifiers: eDoc: 238134
 Degree: -

Event

show

Legal Case

show

Project information

show

Source 1

show
hide
Title: Journal of Electronic Materials
Source Genre: Journal
 Creator(s):
Affiliations:
Publ. Info: -
Pages: - Volume / Issue: 34 Sequence Number: - Start / End Page: 137 - 142 Identifier: -