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  Damage behavior of 200-nm thin copper films under cyclic loading

Zhang, G. P., Volkert, C. A., Schwaiger, R., Arzt, E., & Kraft, O. (2005). Damage behavior of 200-nm thin copper films under cyclic loading. Journal of Materials Research, 20(1), 201-207.

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 Creators:
Zhang, G. P.1, Author           
Volkert, C. A.1, Author           
Schwaiger, R.1, Author           
Arzt, E.1, 2, Author           
Kraft, O.1, Author           
Affiliations:
1Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655              
2Universität Stuttgart, Institut für Metallkunde, ou_persistent22              

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Free keywords: MPI für Metallforschung; Abt. Arzt;
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Language(s): eng - English
 Dates: 2005-01
 Publication Status: Issued
 Pages: -
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 Table of Contents: -
 Rev. Type: Peer
 Identifiers: eDoc: 240397
 Degree: -

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Title: Journal of Materials Research
Source Genre: Journal
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Pages: - Volume / Issue: 20 (1) Sequence Number: - Start / End Page: 201 - 207 Identifier: -