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  Evolution of microstructure and stress of and associated whisker growth on Sn layers sputter-deposited on Cu substrates

Sobiech, M., Krüger, C., Welzel, U., Wang, J. Y., Mittemeijer, E. J., & Hügel, W. (2010). Evolution of microstructure and stress of and associated whisker growth on Sn layers sputter-deposited on Cu substrates. Journal of Materials Research, 25, 2166-2174.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-4FA9-4 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-4FAA-2
Genre: Journal Article

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 Creators:
Sobiech, M.1, Author           
Krüger, C.1, Author           
Welzel, U.1, Author           
Wang, J. Y.1, Author           
Mittemeijer, E. J.1, 2, Author           
Hügel, W., Author
Affiliations:
1Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497644              
2Universität Stuttgart, Institut für Materialwissenschaft, ou_persistent22              

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Free keywords: MPI für Metallforschung; Abt. Mittemeijer;
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Language(s): eng - English
 Dates: 2010
 Publication Status: Issued
 Pages: -
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 Table of Contents: -
 Rev. Type: Peer
 Identifiers: eDoc: 531994
 Degree: -

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Title: Journal of Materials Research
Source Genre: Journal
 Creator(s):
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Publ. Info: -
Pages: - Volume / Issue: 25 Sequence Number: - Start / End Page: 2166 - 2174 Identifier: -