Frequency effect on thermal fatigue damage in CU interconnects

Park, Y.-B.; Mönig, R.; Volkert, C. A.

Local TagsRelease HistoryDetailsSummary

Frequency effect on thermal fatigue damage in CU interconnects

Park, Y.-B., Mönig, R., & Volkert, C. A. (2006). Frequency effect on thermal fatigue damage in CU interconnects. TMS 2005 - Mechanical Behaviour of Thin films and Small Structures, TMS Symposium 2005 Mechanical Behaviour of Thin Films, 3253-3258.

Item is Released

show all hide all

Basic

show hide

Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-4618-0 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-4619-E

Genre: Journal Article

Files

show Files

Locators

show

Creators

show

hide

Creators:
Park, Y.-B.¹, Author
Mönig, R.¹, Author
Volkert, C. A.¹, Author

Affiliations:
1Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655

Content

show

hide

Free keywords: MPI für Metallforschung; Abt. Arzt;

Abstract: -

Details

show

hide

Language(s): eng - English

Dates: Date issued: 2006-02-24

Publication Status: Issued

Pages: -

Publishing info: -

Table of Contents: -

Rev. Type: Peer

Identifiers: eDoc: 319077

Degree: -

Event

show

Legal Case

show

Project information

show

Source 1

show

hide

Title: TMS 2005 - Mechanical Behaviour of Thin films and Small Structures, TMS Symposium 2005 Mechanical Behaviour of Thin Films

Source Genre: Issue

Creator(s):
Zhang, X., Editor
Minor, A., Editor
Schneider, J., Editor
Ma, E., Editor
Boyce, B., Editor
Muhlstein, C., Editor

Affiliations:
-

Publ. Info: -

Pages: - Volume / Issue: - Sequence Number: - Start / End Page: 3253 - 3258 Identifier: -

Source 2

show

hide

Title: Thin Solid Films

Source Genre: Journal

Creator(s):

Affiliations:

Publ. Info: -

Pages: - Volume / Issue: 515 (6) Sequence Number: - Start / End Page: - Identifier: -