Budiman, A. S., Tamura, N., Valek, B. C., Gadre, K., Maiz, J., Spolenak, R., Caldwell, W. A., Nix, W. D., & Patel, J. R. (2004). Unexpected mode of plastic deformation in Cu damascene lines undergoing electromigration. In R., Carter, C., Hau-Riege, G., Kloster, T.-M., Lu, & S., Schulz (Eds.), Materials, Technology, Annealability for Advanced Interconnects and Low-k Dieelectrics (pp. F7.3.1-F7.3.6). Boston: MRS.